BIG INNO


Solid storage for Datacenter, HPC, Cloud, Embedded, IoT, Mobile & in-vehicle infotainment.

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eMMC, eMCP, UFS


1.0 mm

Compact, slim, 153 ball BGA.

256 GB

MLC & TLC NAND Flash.

0.5 W

Low power requirements.

530 MB/s

Consistent performance.

eMMC & UFS


BIG INNO MA series eMMC. BIG INNO FS series 3D NAND UFS.

Download overview
MA100 MA110 MA200 FS100
Type MLC TLC 3D NAND 3D NAND
Form BGA 153 BGA 153 BGA 153 BGA 153
Interface eMMC eMMC eMMC UFS
Capacity (GB) 8~32 8~32 32~128 32~256
Op. Temp. (°C) -25~+85 -25~+85 -25~+85 -25~+85
Size (mm) 11.5x13x1 11.5x13x1 11.5x13x1 11.5x13x1
Available Q4'17 Q4'17

LP-DDR3 eMCP


BIG INNO MX series Low power DRAM eMCP.

Download overview
MX100 MX110 MX200
Note LPDDR3 LPDDR3 3D NAND
Form BGA 221 BGA 221 BGA 221
Interface eMMC eMMC eMMC
Capacity (GB) 8 8~16 32
RAM (Gb) 4~8 8~16 16
Op. Temp. (°C) -25~+85 -25~+85 -25~+85
Size (mm) 11.5x13x1 11.5x13x1 11.5x13x1
Available Q4'17

M.2 PCIe SSD


3.0 mm

Gumstick memory.

512 GB

MLC NAND Flash.

+85 °C

Industrial temperature.

1 GB/s

NVMe M.2 SSD.

2.5" SSD


BIG INNO C & W Series. Backward compatible with SATA and SAS.

High value, low power SSD


7.0 mm

Slim 2.5" Solid State Drive.

1 TB

High density 3D NAND.

0.025 W

Idle power consumption.

560 MB/s

Peak performance.

Enterprise storage


Dual port

Redundancy, Failover & High Availability.

8 TB

Scaling & Consolidation.

500k IOps

With low response time.

3.6 GB/s

NVMe PCIe Gen 3 x4.

Integrated storage


BIG INNO optimizes solid state devices for mobiles, laptop, desktop and server.
Simplifying your design and reducing time to market.

Foxconn Technology Group | iDSBG | SWD

Subsidiary of Foxconn, Hon Hai Precision Industry.


BIG INNO is a dedicated taskforce, mainly composed of firmware engineers with a decade long experience with SSD/eMMC.

Young Liu

Sharp, Director, Board Member.

Foxconn, General Manager.

Socle, Chairman.

Alex Kuo

Memoright, President.

nVidia, Vice President.

Uli, CEO.

R&D

60% of the team.

Firmware experts.

10 years experience in SSD.

Systems Engineering

driven by Applications,

Integration,

& Testing.

in-House Firmware Development

Strict Manufacture Control

Solid Quality Assurance

Field Engineering Support